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  "page": "https://www.calculatorx.com/calc/electric/mosfet-tj",
  "api": "https://www.calculatorx.com/api/v1/calc/mosfet-tj",
  "schema_input": "https://www.calculatorx.com/schemas/electrical.mosfet.tj.input.json",
  "schema_output": "https://www.calculatorx.com/schemas/electrical.mosfet.tj.output.json",
  "assumptions": [
    "Steady-state lumped thermal resistance",
    "Rθ constant (not Zth(t))",
    "RθJA is an effective / application value for the user's thermal environment, not a JEDEC-board package constant",
    "JC+CA is a case/heatsink-dominant lumped single-path approximation; it does not model parallel heat-flow through PCB, leads, or package surfaces"
  ],
  "limitations": [
    "Steady-state only; not Zth or CFD",
    "Rth_JA is effective/application RθJA for the user's PCB and cooling environment, not a universal JEDEC package constant",
    "JC+CA is a case/heatsink-dominant lumped single-path approximation; it is not a universal equivalent of RθJA and ignores parallel PCB/package heat flow",
    "Rth_JA and Rth_JC or Rth_CA together is schema-invalid and CONFLICTING_INPUTS"
  ],
  "boundary_conditions": [
    "No Rth → MISSING_REQUIRED_INPUT",
    "Only one of JC/CA → NEEDS_TWO_INPUTS",
    "Rth_JA together with Rth_JC or Rth_CA → CONFLICTING_INPUTS",
    "P < 0 → VALUE_MUST_BE_NON_NEGATIVE",
    "Rth ≤ 0 → VALUE_MUST_BE_POSITIVE"
  ],
  "sources": [
    {
      "title": "Texas Instruments SPRA953D — Semiconductor and IC Package Thermal Metrics",
      "section": "RθJA, RθJC, and application dependence of junction-to-ambient metrics",
      "url": "https://www.ti.com/lit/pdf/spra953",
      "supports": "Tj ≈ Ta + P·RθJA as a thermal-metric estimate; RθJA is test-condition specific and is not a universal equivalent of RθJC+RθCA",
      "kind": "reference",
      "accessed": "2026-08-15"
    },
    {
      "title": "onsemi AND9016 — MOSFET Thermal Resistance",
      "section": "Junction-to-case / case-to-ambient thermal path",
      "url": "https://www.onsemi.com/download/application-notes/pdf/and9016-d.pdf",
      "supports": "Two-segment RθJC + RθCA for a case/heatsink-dominant path when package-bottom/PCB heat flow is neglected; RθCA lumps interface and heatsink-to-ambient",
      "kind": "reference",
      "accessed": "2026-08-15"
    },
    {
      "title": "JEDEC JESD51 series — Integrated circuit thermal measurement",
      "section": "Methodology for package thermal metrics",
      "supports": "Definition of junction-to-ambient and junction-to-case thermal metrics on specified test boards",
      "kind": "standard"
    }
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